Vapour Chambers

Vapour Chambers
Details:
Vapor Chamber Heat Sink for LED Lighting: Designed specifically for LED lighting, this vapor chamber heat sink offers superior cooling performance with a smaller, lighter design compared to traditional heat sinks. Its advanced technology ensures efficient heat dissipation, making it the ideal solution for compact and high-performance LED applications.
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Description
Technical Parameters

Brief Introduction

We have focus on this new type of heat transfer technology for over 5 years and we feel honour to have achieved 13 patents for it. The research and development of High-power phase change radiator includes instantaneous high temperature hot melt welding technology, low boiling point heat transfer media synthesis technology, high vacuum forming technology and reasonable thermal design technology.

 

 

Product Details

 
Model NO. KX-01007
Material Aluminum 6063-T5 / 6060-T6
Surface Treatment Black Anodizing / Sand Blasting / As your requirement
Origin Foshan China
Trade Terms FOB / CIF / CFR / EXW / DDP
Service ODM / OEM
product-642-530

Aluminum Vapor Chamber

product-643-521

Vapor Chambers Heatsink

product-648-515

Phase Change Vapor Chamber

Our Technologies – Vacuum vapor Chamber

 

A vapor chamber is a planar heat pipe that can spread heat in two dimensions. The benefits of vapor chambers include that they are isothermal and can be used to cool multiple components while sustaining low thermal resistance.

 

 Two-dimensional heat transfer performance is superior to that of metal materials and heat pipes.

 

 Thermal conductivity equivalent to 5000W/m·K or more.

 

 Meet the heat dissipation requirements of power devices within 10W-10KW and above.

product-656-669

 

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The advantage of vapor chamber heat sinks
 
 

01

Super Thermal Conductivity

Vapor chamber heat sinks utilize a two-phase heat transfer mechanism that provides exceptionally high thermal conductivity, far surpassing traditional solid metal heat sinks.

02

Without Power Consumption

Vapor chambers operate passively, requiring no external power source. It relies on the natural phase change cycle of the working fluid with no pumps, fans, or moving parts required for operation

03

Light Weight and Small Size

The thin profile allows for use in space-constrained applications and reduces the overall weight of cooling solutions in portable devices

04

Cost  Effective for Heat Dissipation

While initial costs may be higher than simple heat sinks, vapor chambers can be cost-effective in the long run because it reduces the need for additional cooling components like fans or liquid cooling systems

 

 

Comparison of Different thermal Solutions

 

 

 

Your Solutions

Phase change

Brass

Micro Slot Group

Small Heat Pipe Splicing

Sealability

Applying high temperature hot melt welding, non-molecular leakage

Using a screw seal, the leakage rate of 90%

Using argon arc welding and brazing, the leakage rate of 50%

Using heat pipe plus fins, the leakage rate of 5%

Structure

Phase change aluminium

Hot column

Micro slot group

Small heat pipe stitching

Heat-flux density

16000W/cm²

400W/cm²

400W/cm²

280W/cm²

Temperature Increasing control

≤30℃

≤35℃

≤38℃

≤35℃

Thermal Resistance / Contact Point

Same material

Two kinds of material

One kind material

Two kinds of material

Processing

Simple

Complicate

Simple

Complicate

Combination  Ways

Hot melt welding

Mount

Adhesive

Mount

 
The Main Technical Indicators of The Project

 Temperature uniformity: the radiator at the rated heat flux density, the temperature

    difference from the bottom plate to the top ≤ 7 ℃

 

 Thermal resistance≤0.14℃/W

 

 Standard temperature rise:≤25℃

 

 Temperature impact:-55℃~85℃ 

 

 Vibration frequency:0~200HZ

 

 Power Spectral Density:0.2g2/HZ

 

 Helium mass spectrometry leak detection<2×10-8Pa. L/S

 

 Substrate temperature≤60℃

 

 Ambient temperature:-50℃~120℃

 

 Weight:3.8KG~6KG±5%

 

 

Alternative Technologies in vapor chamber Heatsink

Phase Change Self RD Heatsink
01.

High heat density alloy plate synthesis technology

The traditional sunflower heatsink with pure aluminum plate, because the heat flux of aluminum is small, the impact of thermal conductivity and pure aluminum tapping teeth can not be locked, ① lead to the light source substrate can not be tight with the radiator in a long time. With the heat dissipation body from the light source substrate, loss of heat dissipation; ② optical lens ring can not be long-term effective compression which lead to not water-proof; ③ can not achieve hot-melt welding. High heat density alloy plate can solve the above defects, in the structural cooling technology is a technological breakthrough.

02.

Instant high-temperature hot melt welding technology

Learn from Germany's aluminum welding technology, after repeated numerous experiments, the use of metal relative to high-speed movement to produce heat, instantaneous melting metal contact surface, and then the appropriate time parameters to complete the emergency stop welding. So that the manufacture of heat-conductive cavities without molecular-grade leakage can be achieved. The technology is the company's original technology, the traditional process can not be completed.

Traditional Round Aluminum Heatsink
 
product-762-453
03.

Low boiling point heat transfer medium synthesis technology

On the basis of the experiment, a low boiling point heat medium is synthesized, which has a boiling point of 16 ° C in the vacuum state and no corrosion in the heat conduction cavity, which greatly improves the heat transfer of the phase change medium Speed, to achieve a moment of thermal conductivity, reducing the temperature rise. Then the traditional radiator to reduce the temperature rise around 30°C.

04.

High vacuum forming technology

High vacuum forming technology: the heat inside the cavity vacuum will greatly affect the phase change heat transfer medium heat transfer effect, the use of traditional vacuum is difficult to achieve a high degree of vacuum, after a long period of time to master the high vacuum forming technology

product-815-499
 
Reasonable Thermal Design Technology in Cold Plate CFD Design
05.

Reasonable thermal design technology

The use of supercomputing system for thermal simulation, thermal conductivity, heat height match, to save material, reduce costs, reducing the weight of the purpose.

 

 

 

Now Let Kaixin Design Your Vapor Chamber

Kaixin Enterprise is a one-stop partner for aluminum heat dissipation products and aluminum fabrication. Our philosophy places our customers and the quality of our products as the core priority.

 

Our address

Foshan City, Guangdong Province, China.

 

Whatsapp

+86-13922754506

 

E-mail

info@kx-alu.com

Kaixin Professional Teams

 

 

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