Vapour chamber Heat Sinks aluminium Liquid cooling heat sink with SGS certificate Brief Introduction: Vapour chamber Heat Sinks aluminium Liquid cooling heat sink with SGS certificate We have focus on this new type of heat transfer technology for over 5 years and we feel honour to have achieved...
We have focus on this new type of heat transfer technology for over 5 years and we feel honour to have achieved 13 patents for it. The research and development of High-power phase change radiator includes instantaneous high temperature hot melt welding technology, low boiling point heat transfer media synthesis technology, high vacuum forming technology and reasonable thermal design technology.
The advantage for vapour chamber heat sinks:
1. super thermal conductivity
2. super cooling capacity
3. no power consumption cooling
4. light weight, small size
5. high reliability
6. cost-effective, environmental friendly
Model NO.: KX-020
Origin: Foshan China
Heat sink Material: Aluminum AA6063/AA6060
Comparison of technical performance advantages;
our Phase change technology
Micro slot group technology
Small heat pipe splicing technology
applying high temperature hot melt welding, non-molecular leakage
Using a screw seal, the leakage rate of 90%
Using argon arc welding and brazing, the leakage rate of 50%
Using heat pipe plus fins, leakage rate of 5%
phase change aluminium
Micro slot group
Small heat pipe stitching
temperature increasing control
Thermal resistance / contact point
two kinds of material
one kind material
two kinds of material
Hot melt welding
The main technical indicators of the project
1. Temperature uniformity: the radiator at the rated heat flux density, the temperature difference from the bottom plate to the top ≤ 7 ℃;
2. Thermal resistance≤0.14℃/W；
3. Standard temperature rise：≤25℃；
4. Temperature impact：-55℃～85℃ ；
5. Vibration frequency：0～200HZ；
6. Power Spectral Density：0.2g2/HZ；
7. Helium mass spectrometry leak detection＜2×10-8Pa。 L/S；
8. Substrate temperature≤60℃
9. Ambient temperature：-50℃～120℃；
Related technical parameters；
High heat density alloy plate synthesis technology: the traditional sunflower radiator with pure aluminum plate, because the heat flux of aluminum is small, the impact of thermal conductivity and pure aluminum tapping teeth can not be locked, ① lead to the light source substrate can not be tight with the radiator in a long time. With the heat dissipation body from the light source substrate, loss of heat dissipation; ② optical lens ring can not be long-term effective compression which lead to not water-proof; ③ can not achieve hot-melt welding. High heat density alloy plate can solve the above defects, in the structural cooling technology is a technological breakthrough.
Instant high temperature hot melt welding technology: learn from Germany's aluminum welding technology, after repeated numerous experiments, the use of metal relative to high-speed movement to produce heat, instantaneous melting metal contact surface, and then the appropriate time parameters to complete the emergency stop welding. So that the manufacture of heat-conductive cavities without molecular-grade leakage can be achieved. The technology is the company's original technology, the traditional process can not be completed.
Low boiling point heat transfer medium synthesis technology: On the basis of the experiment, a low boiling point heat medium is synthesized, which has a boiling point of 16 ° C in the vacuum state and no corrosion in the heat conduction cavity, which greatly improves the heat transfer of the phase change medium Speed, to achieve a moment of thermal conductivity, reducing the temperature rise. Than the traditional radiator to reduce the temperature rise around 30°C.
High vacuum forming technology: the heat inside the cavity vacuum will greatly affect the phase change heat transfer medium heat transfer effect, the use of traditional vacuum is difficult to achieve a high degree of vacuum, after a long period of time to master the high vacuum forming technology, Up to 10-2.
Reasonable thermal design technology: the use of supercomputing system for thermal simulation, thermal conductivity, heat height match, to save material, reduce costs, reduce the weight of the purpose.