Heat Sink

When the area of​the heat source is relatively large and the heating surface cannot be well covered by one heat pipe, the economy of using multiple heat pipes is not as good as that of using a

Stir welding is highly reliability and strength.

The aluminum vapor chamber has good processability and can be well combined with the radiator to quickly diffuse the heat and make the radiator perform better. At the same time, due to the hollow

Aluminum vapor chamber products are more and more used by various aircrafts, vehicles and portable equipment due to their light weight and good thermal conductivity.

Kaixin are committed to providing the liquid-cooling solution for our customers. This liquid cooling plate is manufactured into embedded tube for filling liquid to cool the heat energy. The

When the area of​the heat source is relatively large and the heating surface cannot be well covered by one heat pipe, the economy of using multiple heat pipes is not as good as that of using a

When it is necessary to transfer heat at a lower temperature, such as the temperature range between -40 and 20 °C, copper heat pipes or copper vaporizing plates that use water as the working fluid

Inflatable vapor chamber products can spread the heat evenly to any corner of the surface. Using as a heat dissipation fin can improve the heat diffusion speed and improve the heat dissipation

This large aluminum heat sink is mainly used in the new energy vehicle. By adding the teeth on the heat sink fins and given the size of the heatsink unchanged, the extra surface is added to absorb

We have exported this high-quality aluminum solid state relay heatsink to the European market for over 8 years. The solid state relay heatsink is used in various areas as your requirements.

Liquid Cooling Aluminum Heat Sink has the characteristics of beautiful appearance, light weight, good heat dissipation performance and good energy saving effect.

Kaixin launched this new thin and lightweight superconducting thawing board and with the core technology of PIC microgravity molecular technology and graphene plus high purity aluminum fusion